Keynote 1

Title: Securely Connected Vehicles – What it takes to make self-driving cars a reality 
Speaker: Lars Reger, CTO Automotive, NXP Semiconductors, Hamburg, Germany

Abstract: The car is evolving. It is transforming from a mode of transport to a self-driving robot and information hub. Cars are enabling consumers to seamlessly integrate their mobile and wearable devices and soon it will also drive autonomously. Wireless technologies play a key role in creating the autonomous driving experience. The rise of secure vehicle-to-everything (V2X) communications, affordable compact radar solutions and Ethernet for high-bandwidth data transfer are making it ever closer to becoming a reality. Self-driving cars will integrate a variety of interfaces for collecting and analyzing data from other vehicles and their surroundings. While being essential to making this possible, this connectivity also exposes cars to vulnerabilities such as hackers and viruses. Powerful, reliable wireless technologies combined with highest level of privacy and system security will be critical. Lars Reger outlines what it takes to realize the secure connected car of the future. 

Biography: Lars Reger is Chief Technology Officer of NXP’s Automotive business unit. NXP is the global technology leader in the secure connected car with a market leading product portfolio in secure and smart car access, car infotainment, advanced driver assistance systems, in-vehicle networks, and sensors. As CTO, Lars is responsible for managing R&D and new business activities for NXP Automotive.  

Prior to joining NXP in 2008, Lars gained deep insight into the microelectronics industry – with a strong focus on the automotive sector – in various functions with Siemens, Infineon, Siemens VDO and Continental. Before joining NXP, Lars was Director of Business Development and Product Management within the Connectivity business unit at Continental. His past roles at Infineon included Head of the Process and Product Engineering departments, Project Manager for Mobile System Chips, and Director of IP Management. He began his career with Siemens Semiconductors as Product Engineer in 1997. Lars holds a university degree in physics from Rheinische-Friedrich-Wilhelms University of Bonn and an executive MBA from London Business School.

Keynote 2

Title:  Is IoT Coming to the Rescue of Semiconductor?
Speaker: Professor Cheng-Wen Wu, Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan, 

Abstract: The notion of Internet-of-Things (IoT) has been around for decades, and has been seriously discussed in the industry and academia in the past ten years at least. It has long been identified, or expected, as the main driving force of growth for many industries in the future. However, so far there is not so much evidence that IoT will likely give a great boost to the semiconductor industry (that we are all concerned here) in the near future. People are realizing that IoT is NOT a tangible industry, but instead just a phenomenon or notion of industry migration toward “Smart and Connected Everything.” As IC test engineers or scientists, should we or should we not bet on IoT with our future? Why? If IoT is really coming to the rescue of the struggling semiconductor industry, what will be the key factors of its success? In my talk, I will try to address these issues, from not just technological but also economic and social points of view. I will stress IC as well as system test.

Biography: Cheng-Wen Wu received the BSEE degree from National Taiwan University in 1981, and the MS and PhD degrees in ECE from UCSB in 1985 and 1987, respectively. Since 1988, he has been with the Department of EE, National Tsing Hua University (NTHU), Hsinchu, Taiwan, where he is currently a Tsing Hua Distinguished Chair Professor and Senior Vice President for Research. He has served in the past as the Director of Computer Center, Chair of EE Department, Director of IC Design Technology Center, and Dean of the College of EECS. He was on leave from NTHU, 2007-2014, serving at ITRI as the General Director of the SOC Technology Center (STC), and the Vice President and General Director of the Information and Communications Labs. Dr. Wu received the Distinguished Teaching Awards (twice) from NTHU, the Outstanding Electrical Engineering Professor Award from the Chinese Institute of Electrical Engineers (CIEE), the Distinguished Research Awards (three times) from National Science Council, the Industrial Collaboration Awards (twice) from the Ministry of Education (MOE), the Academic Award from MOE, the Continuous Service Award and Outstanding Contribution Award from the IEEE Computer Society, the Distinguished Industrial Collaboration Award from NTHU, the National Invention Award (Silver Medal) from Ministry of Economic Affairs, and the TECO Award. He became a Golden Core Member of the IEEE Computer Society in 2006. In 2013, he received the National Endowed Chair Professorship from MOE. His research interests include design and test of high performance VLSI circuits and systems, and test and repair of semiconductor memory. He is a life member of the CIEE, a life member of Taiwan IC Design Society, and a Fellow of the IEEE.

Keynote 3

Title: Testing in the Year 2024 – Big Changes are Coming
Speaker: Phil Nigh, GlobalFoundries, USA.

Abstract: We are facing major technological, cost & complexity challenges. Today, I believe we understand the drivers and emerging challenges -- but I don't think we've grasped how these changes will impact testing and how we will deliver high quality/reliability products.  In this talk, I'll give my view on what Testing will be like 8 years from now.  Now is the time to start planning for these changes.

• Products will be a heterogeneous mix of IC components from multiple foundries -- each built using technologies optimized for cost and performance -- combined into a final component where this complexity is not apparent in the final application. 
• Products will adapt themselves to process variation, circuit marginalities, environmental changes and aging -- thereby simplifying Testing and achieving superior fault tolerance and power/performance.
• Data & Analytics will drive all production processes with particular improvement in exploiting real-time adaptation during the testing & manufacturing process. Testing will be viewed more as a production personalization and data collection process (driving fab/design improvements) -- than just sorting pass/failing dies.